A federal government investment grant paired with matching funds from Hendon Semiconductors, a division of Legend Corporation, will modernise Hendon’s Defence Manufacturing Capability.

Hendon Semiconductors received a grant of $690K from the Federal Government’s Sovereign Industrial Capability Priority Grant Scheme for its plans to upgrade its facilities by acquiring advanced manufacturing equipment, to enhance its Hybrid Integrated Circuit (HIC) and Printed Circuit Board Assembly (PCBA) production capabilities as well as its sustainment services for the defence sector.

“I’m thrilled at the opportunity to fast-track Hendon’s modernisation, particularly in relation to our ability to quickly develop quality prototypes without the reliance on overseas partners, strengthening and significantly accelerating innovation in Defence and other industries in Australia, something we’re very passionate about,” Hendon Semiconductors executive general manager Brenton Judge says.

A total investment of $1.6m including the matched funds from Hendon Semiconductors will allow the company to procure and install state-of-the-art equipment including PCB prototyping equipment, flying probe test systems, a conformal coating machine, an x-ray machine and soldering robots.

The upgraded facility will be completed in October 2024, though most equipment will be online in early March.